Hardware Architect

Job Description

Job Description: As a member of Concept Engineering Hardware Architecture team that specifies the solutions for 2.5G and 3G handset baseband chips, the candidate will be responsible for the Digital Baseband portion of the solution. This includes the overall HW architecture meeting the functionality and performance specified by the System Requirements. The candidate would be responsible for generating the Subsystem Requirements, allocating the system requirements to the different baseband subsystems of the solution and specifying the implementation architecture to meet the requirements. The responsibilities of the Hardware Architect include some or all of the following: *Definition of Digital Baseband HW architecture Deep understanding of ARM/DSP based SoC architectures, bus architectures, peripherals, and security features. Ability to design, implement, and simulate system models for architecture tradeoff and bandwidth analysis The candidate will also be expected to: Comprehend and communicate competitor Digital Baseband architectures and capabilities. Develop System Functional specifications that will be used to guide the Development organizations during product development. Generate system level requirements for the Digital Baseband portion of a product based on Marketing Requirements Document and industry norms. Willing to travel international to Germany is required.

Skills required

Minimum Requirements: Bachelors degree in Electrical Engineering 3 years engineering experience 3 years experience with ARM based SoC architecture solutions Preferred Requirements: Masters degree in Electrical Engineering 3 years experience and understanding of GSM/GPRS/UMTS Handset systems 3 years experience and understanding of IC design, simulation, and testing methodologies Understanding of Mobile handset system architectures including: o Analog baseband HW architectures and interfaces o Power management IC HW architectures and interfaces o Radio/RF HW architectures and interfaces o Knowledge of external component functionality and interfaces: memory, display, camera, external memory cards, connectivity (USB, BT, etc.) Understanding of power savings techniques, technology, and algorithms o Ability to review and analyze process technologies and process options in support of low power design o Understanding of low power IC design architectures and system design architectures. Understanding of IC design process and designs o Process technologies, standard cell libraries, memories, PLLs, clock generation, I/O buffers

Experience Required

3 years

Country

City

Pennsylvania

Company/Employer

Intel

Address

  • Address: Intel Research Pittsburgh Carnegie Mellon, Pittsburg CM2 4720 Forbes Ave, Suite 410 Pittsburgh, PA 15213 United States of America

Contact

Company Info

Employees in the Intel Architecture Group (IAG) deliver innovative platforms across computing and communication segments including data centers, mobile and desktop personal computers, handhelds, embedded devices and consumer electronics. Intel's industry leading technology is used to create integrated hardware and software solutions such as processors, chipsets, communication radios, graphics processors, motherboards, and networking components that deliver capabilities from security and manageability to computing performance and energy efficiency. IAG employees are at the forefront of enabling a new era of computing that is more integrated into all aspects of our daily lives. ------------------------------------------------------------------------------------------------------------------------------------------------- Intel Mobile Communications (IMC) develops and markets innovative system solutions for cellular wireless communications by leveraging our unique advantages in the areas of semiconductors, RF, mixed-signal, power management, and platform software (protocol stack and applications). IMC targets the fast growing market segments of smart phones, converged devices, and ultra-low-cost/entry phones. Our roadmap is focused to provide the most cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and to offer best-in-class 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices. Intel Mobile Communication has formerly been a division of Infineon Technologies AG, called Wireless Solutions (WLS). Early in 2011, Intel Corporation has fully acquired the profitable and fast growing division with more than 3500 talented employees worldwide.

Author

Darshan C

Hits

583

Creation Date

Monday, 20 June 2011

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