Materials Analysis Engineer

Job Description

As a Materials Analysis Engineer you will be part of Technology Development Labs responsible for identifying and developing advanced materials characterization and failure analysis techniques in support of Intel's next generation silicon process development. Your responsibilities will include but are not limited to: o Develop and Implement materials characterization techniques and collaborate with process development engineers to determine fundamental materials properties and correlate these properties with integrated process technology to improve process performance and reliability. o Analyze failure reports and recommend corrective action to prevent reoccurrence of problems. o Support new process/product transfer and startup and the automation and improvement of the failure analysis process. o Ensure that materials/failure analysis capabilities needed to support advanced process technology and/or product development are in place. May necessitate the development of improved/new tools and methods.

Skills required

You must possess the below minimum qualifications to be consider for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience can be obtained through a combination of prior education, current MS/PhD course work, projects, research and any relevant prior job/internships. Minimum Qualifications: o This is an entry level position for a technical college graduate with a Master of Science or Ph.D. degree in Materials Science, Chemistry, Physics, Mechanical Engineering, or Chemical Engineering, o Minimum 1 year experience with imaging or chemical analysis using equipment such as TEM/STEM, SEM, FIB, EDX/EELS, SIMS, TOFSIMS, MEIS, RBS, Atom Probe and advanced gas/liquid analytical chemistry techniques. Preferred Qualifications: o Graduating with a Ph.D. is preferred o Prior Intel Intern or Scholarship recipient o 6 months experience in one or more of the following areas: thin film process deposition and characterization, semiconductor device physics, interconnect reliability, reliability statistics. o Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.

Experience Required








  • Address: Casper Wireless Lab 12 6200 NW Casper Place Hillsboro, OR 97124 United States of America


Company Info

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.


Darshan C



Creation Date

Monday, 20 June 2011 Android app